Proc10M

Ultra-Compact High-Performance Stratix10MX HBM2 Module

The Startix10 MX offers 10X more DRAM and SRAM bandwidth than discrete DDR4 and QDR memories. Gidel’s Proc10M module is designed for ease-of-use and immediate accessibility to this powerful technology for computer-based, embedded systems and edge computing. The combination of the Proc10M’s large FPGA, huge memory bandwidth and 1,600 Gb/s IOs enables unprecedented level of processing, system compactness and cost performance. The powerful Proc10M opens the way to implement diverse innovations and high-end applications, including:

  • Compact Broadcast and Image-Processing solutions enabling to grab data from multiple fast edge sensors and to perform image enhancements,
    processing, recognition, compression and AI inferences.
  • 5G and Radar combining high-speed digital I/O interfaces and edge computing such as FFTs to selectively reduce data and offload it via
    PCIe x16 or dedicated links.
  • Ultra-fast switch for wireline traffic management up to 800G and single device solution for Deep Packet Inspection (DPI)
  • AI training leveraging 128GB density, HBM2s’ huge bandwidth and the FPGA’s massive logic and DSP blocks.

The Proc10M module has been designed for use with carrier boards to enable tailoring solutions that significantly reduce risks, costs and time to market. User carriers may incorporate any combination of Rx, Tx or full duplex transceivers. Gidel’s off-the-shelf carrier board can be used as is for deployment or as a development and reference board for developing a custom carrier board. Gidel’s Proc1C half-length PCIe carrier includes PCIe Gen. 3 x16, 4 xQSFP28, PHS and GPIOs. The PHS interface enables connecting board-to-board or mounting a daughter board such as Gidel’s 8 x CoaXPress-12.

High-end solutions can be achieved within remarkable short time using the Proc10M module, Gidel/user carrier boards and Gidel’s powerful development suite, thus significantly accelerating the time to market and improving the ROI.

Contact Information

North America:

+1 408 969 0389

EMEA:

+972 4 610 2500

Asia Pacific:

+972 4 610 2500

  • Large HBM2 FPGA with ultra-compact module
    (97.4mm x 101mm / 3.83” x3.98”)
  • Flexible usage via customized carrier board or via Gidel’s carrier board
  • Stratix 10MX 2100 HBM2 FPGA:
    • 2,073,000 LEs
    • 7,920 18 x19 multipliers
  • 5-level memory scheme (50TB/s+):
    • 400 GB/s access to DRAM
    • 90 GB/s access to SRAM
    • Max capacity>128 GB:  8/16GB on module + up to 128GB on carrier
  • 72 Transceivers with bandwidth > 1,600 Gb/s (TX+RX):
    • 48 x up to 26 Gb/s
    • 16 x up to 16 Gb/s or PCIe Gen3x16
    • 8 x up to 16Gb/s
    • Option for 64 x up to 26 Gb/s
  • 374 I/Os supporting:
    • 26 x 3.3V IOs
    • 96 x LVDS (1.6Ghz/line)
    • 72 bit DDR4 interface
  • PLLs with jitter cleaners(100fs)
  • 10 dedicated input reference clocks
  • 2 x output reference clock
  • Supports up to 120W (@12V)
  • Active or passive cooling
  • May be used on half-length PCIe
    carrier board
  • Supported by Gidel Proc Dev Kit (via
    a PCIe carrier)

*      Option for 5 x 26G or 8 x 16G

**    Option for 11 x 26G, 16 x 16G or 16 x PCIe Gen. 3

*** Design may implement a combination of LVDSs and GPIOs

  • Broadcast
  • Image Processing
  • 5G and Radar
  • Ultra-fast switch
  • AI training
FeatureSpecification
FPGA• Intel Stratix 10 MX
• 2,073 K logic elements
• 7,920 embedded 18x19 multipliers
• Embedded M20K and MLAB blocks
• Up to 72x 26/16 Gb/s transceivers for a total bandwidth>1,600 Gb/s
• 1.6 Gb/s LVDS performance
Memory5-Level memory scheme:
• 11 Gb (17K) x MLAB blocks @ 50 TB/s
• 134 Gb (16.8K) x M20K blocks @ 41 TB/s
• 94.5 Mb SRAM @ 90 GB/s
• 8 GB x HBM2 DDR @ 400 GB/s
• Up to 128 GB with ECC DDR4 on Carrier board @ 15 GB/s
Form FactorUltra-compact module (97.4mm x 101mm / 3.83” x3.98”) for mounting on carrier board
Host InterfaceOption for PCIe x16 Gen.3 using Gidel Proc1C carrier board or user defined interface via custom carrier board
I/OOption for 4 xQSFP28, PHS and GPIOs using Gidel's Proc1C or or user defined via custom carrier board
Development ToolsProc Dev Kit:
• Significantly reduces development time and cost while preserving optimized performance
• Enables immediate building of ASP (Application Support Package) optimized to the system requirements by mapping the board resources to the application needs
• Enables parallel access of multiple applications on a single FPGA thus expediting the development and improving system reliability. For example, firewall and compression may be accelerated simultaneously on the same FPGA and controlled by independent applications.
Acceleration BoardFPGA DevicesSpeed GradeHBM2
I/O interface
Proc10M-CAStratix 10 MX 210 28 GBWithout the Top connector, 72 transceivers all up to 16 GHz, option for PCIe x16 using 16 transceivers
Proc10M-BAStratix 10 MX 210 28 GBWithout the Top connector, 72 transceivers (64 up to 26 GHz), option for PCIe x16 using 16 x16 GHz transceivers
Proc10M-CAStratix 10 MX 210 28 GBIncludes the Top connector, 72 transceivers all up to 16 GHz, option for PCIe x16 using 16 transceivers
Proc10M-DAStratix 10 MX 210 28 GBIncludes the Top connector, 72 transceivers (64 are up to 26 GHz), option for PCIe x16 using 16 x 16 GHz transceivers
Proc10M with a Proc1C carrier board models:
Proc1C10M-0Stratix 10 MX 21028 GBPCIe x16 half-size form factor board with Gidel high-speed (PHS) connector
Proc1C10M-2BStratix 10 MX 21028 GBPCIe x16 half-size form factor board with 4 xQSFP28 and Gidel high-speed (PHS) connector
Proc1C10M-2CStratix 10 MX 21028 GBPCIe x16 half-size form factor board with 4 xQSFP28 up to 16G and Gidel high-speed (PHS) connector
Proc1C10M-4BStratix 10 MX 21028 GBPCIe x16 half-size form factor board with 4 xQSFP28 and Gidel high-speed (PHS) connector
Download our data sheet for the Proc10M Module Computation Accelerator.